tree 07073d6ba4af58e79fb91cbc7dfb9b985852005e
parent 98cc093cba1e925eb34963dedb5f1684f1bdb2f4
author Huang Ying <ying.huang@intel.com> 1504740150 -0700
committer Linus Torvalds <torvalds@linux-foundation.org> 1504744048 -0700

mm: test code to write THP to swap device as a whole

To support delay splitting THP (Transparent Huge Page) after swapped
out, we need to enhance swap writing code to support to write a THP as a
whole.  This will improve swap write IO performance.

As Ming Lei <ming.lei@redhat.com> pointed out, this should be based on
multipage bvec support, which hasn't been merged yet.  So this patch is
only for testing the functionality of the other patches in the series.
And will be reimplemented after multipage bvec support is merged.

Link: http://lkml.kernel.org/r/20170724051840.2309-7-ying.huang@intel.com
Signed-off-by: "Huang, Ying" <ying.huang@intel.com>
Cc: "Kirill A . Shutemov" <kirill.shutemov@linux.intel.com>
Cc: Andrea Arcangeli <aarcange@redhat.com>
Cc: Dan Williams <dan.j.williams@intel.com>
Cc: Hugh Dickins <hughd@google.com>
Cc: Jens Axboe <axboe@kernel.dk>
Cc: Johannes Weiner <hannes@cmpxchg.org>
Cc: Michal Hocko <mhocko@kernel.org>
Cc: Minchan Kim <minchan@kernel.org>
Cc: Rik van Riel <riel@redhat.com>
Cc: Ross Zwisler <ross.zwisler@intel.com> [for brd.c, zram_drv.c, pmem.c]
Cc: Shaohua Li <shli@kernel.org>
Cc: Vishal L Verma <vishal.l.verma@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>