mmc: tmio: split core functionality, DMA and MFD glue
TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to
the one, used in MN5774 and other MN57xx controllers. These IP cores are
included in many multifunction devices, in sh-mobile chips from Renesas,
in the latter case they can also use DMA. Some sh-mobile implementations
also have some other specialities, that MFD-based solutions don't have.
This makes supporting all these features in a monolithic driver inconveniet
and error-prone. This patch splits the driver into 3 parts: the core,
the MFD glue and the DMA support. In case of a modular build, two modules
will be built: mmc_tmio_core and mmc_tmio.
Signed-off-by: Guennadi Liakhovetski <g.liakhovetski@gmx.de>
Acked-by: Paul Mundt <lethal@linux-sh.org>
Signed-off-by: Chris Ball <cjb@laptop.org>
diff --git a/drivers/mmc/host/Makefile b/drivers/mmc/host/Makefile
index 30aa686..79c42dd 100644
--- a/drivers/mmc/host/Makefile
+++ b/drivers/mmc/host/Makefile
@@ -29,6 +29,9 @@
obj-$(CONFIG_MMC_S3C) += s3cmci.o
obj-$(CONFIG_MMC_SDRICOH_CS) += sdricoh_cs.o
obj-$(CONFIG_MMC_TMIO) += tmio_mmc.o
+obj-$(CONFIG_MMC_TMIO_CORE) += tmio_mmc_core.o
+tmio_mmc_core-y := tmio_mmc_pio.o
+tmio_mmc_core-$(CONFIG_TMIO_MMC_DMA) += tmio_mmc_dma.o
obj-$(CONFIG_MMC_CB710) += cb710-mmc.o
obj-$(CONFIG_MMC_VIA_SDMMC) += via-sdmmc.o
obj-$(CONFIG_SDH_BFIN) += bfin_sdh.o
